Design of anti-mildew microcapsules
January 13, 2025 | News | No Comments
Researchers have presented anti-mildew microcapsules with chitosan as encapsulant for advanced electronic packaging epoxy coating. Moisture protection, anti-mildew and anti-corrosion are essential to guarantee the normal service of electronic devices. Although epoxy holds great potential for electronic packaging, its inferior anti-corrosive performance and anti-mildew capability significantly affect the lifespan of the coating and thus impede […]